
- Products
- For Heat Dissipation
- Thermal Interface Material
- Anti-bacterial Powder
- Mechanical Parts
- Optical Module
- Other Products
- Thermal Module
- Service
- Case
- Successful Case
- Simulation Case
- …
- Products
- For Heat Dissipation
- Thermal Interface Material
- Anti-bacterial Powder
- Mechanical Parts
- Optical Module
- Other Products
- Thermal Module
- Service
- Case
- Successful Case
- Simulation Case
- Products
- For Heat Dissipation
- Thermal Interface Material
- Anti-bacterial Powder
- Mechanical Parts
- Optical Module
- Other Products
- Thermal Module
- Service
- Case
- Successful Case
- Simulation Case
- …
- Products
- For Heat Dissipation
- Thermal Interface Material
- Anti-bacterial Powder
- Mechanical Parts
- Optical Module
- Other Products
- Thermal Module
- Service
- Case
- Successful Case
- Simulation Case
Thermal Interface Material
PI Thermal Pad
- High thermal conductivity
- Can fill the vacancy perfectly
- Customization(size)
Product description
PI thermal pad is consisted of silica gel, PI film, specific thermal dust and goes through the vulcanization process. Since it's soft and self-adhesive(oneside), it has better tensile strength and voltage resistance, and therefore becomes the ideal material for fill-in thermal conduction.
Product feature
High voltage resistance, self-adhesive(one side), puncture proof, vibration proof, antifriction, easy processing and so on.
Application
LED illumination, industrial communication device, power battery pack, cooling device and so on.
Physical property table