Thermal Interface Material

PI Thermal Pad

• High thermal conductivity
• Can fill the vacancy perfectly
• Customization(size) 

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Product description

PI thermal pad is consisted of silica gel, PI film, specific thermal dust and goes through the vulcanization process. Since it's soft and self-adhesive(oneside), it has better tensile strength and voltage resistance, and therefore becomes the ideal material for fill-in thermal conduction.

Product feature

High voltage resistance, self-adhesive(one side), puncture proof, vibration proof, antifriction, easy processing and so on.

Application

LED illumination, industrial communication device, power battery pack, cooling device and so on.

Physical property table