Thermal Interface Material

Thermal Pad

• High thermal conductivity
• Can fill the vacancy perfectly
• Eco-friendly
• Customization(size) 

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Product description

Thermal pad is a kind of thermal conductive material which is consisted of silica gel, metal-oxide and other auxiliary materials. It's called soft thermal pad, silica gel thermal pad as well. The main function of the product is to fill in the vacancy between the heat sink and heat source to transfer heat energy. Extra functions include insulation shock-absorbing.

Product feature

APD series thermal pad
Thermal conductivity: 1 ~ 8 (W/mK)
Thickness range: 0.3mm ~ 8.0mm
Size range: width 200 mm, length 400 mm
Hardness range: Shore C, between 15 ~ 60
Customization(size, thickness)

Application

Satisfy the need of products which have high power consumption

• Electronic components(including IC，CPU，MOS，LED，DDR and so on)
• Motherboard, power supply, heat sink, LCD TV, set-top box, DVD
• Laptop, desktop pc, telecommunication equipment, wireless hub
• Appliances, automobile electronics, new-energy automotive battery and so on 

Physical property tables