Thermal Interface Material

Thermal Grease

• High Thermal conductivity
• Suitable for products with high heat flux

Product description

This thermal organic paste-complex compound takes organic silicon as main material and adding other materials with outstanding heat resistance and thermal performance. It can stay in paste stage for long time under the temperature from -40℃ to 200℃.

Product feature

Can stay in paste stage for long time to achieve the best filling-in effect. However, it's not self-adhesive.

Application

Laptop, personal computer, TV, dash cam, power board of appliances and so on.

Physical property table